Samsung and TSMC to co

Samsung is partnering with its foundry rival TSMC to jointly develop the bufferless HBM4, a next-generation AI chip, Dan Kochpatcharin, head of Ecosystem and Alliance Management at TSMC, said during the Semicon Taiwan 2024 forum last week. High-bandwidth memory (HBM) is crucial for AI due to its superior processing speed compared to traditional DRAM (dynamic random access memory) chips. Samsung and TSMC will provide customized chips and services requested by clients such as NVIDIA and Google. The bufferless HBM4 will offer 40% greater power efficiency and 10% reduced latency compared to current models, industry analysts have suggested. The two chip giants plan to start mass production of the new chip in the second half of next year, according to the Korea Economic Daily report. [The Korea Economic Daily]